The Engineer
25 May 2001
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Aerojet wins $5 million contract to study shuttle nozzle
31 May 2001
Aerojet has won an eight-month, $5 million contract from NASA to study the feasibility of developing a channel wall nozzle to replace the tube nozzle in the Space Shuttle Main Engine (SSME).
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Hitachi and Cirrus jump on silicon bluetooth wave
31 May 2001
Hitachi and Silicon Wave are to join forces on the development of system-on-chip products using Silicon Wave's Bluetooth 1.1 qualified Baseband IP.
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Infineon and Micron team up to develop fast DRAM
31 May 2001
Infineon Technologies and Micron Technology have signed an agreement to co-develop a new multi-generational family of Reduced Latency DRAM.
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Ink-jet system speeds up process to prototypes
31 May 2001
A new system of rapid prototyping in which complex metal components can be 'printed' directly from CAD data has been developed by a German research institute.
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What's the story labour, tory?
31 May 2001
Is politics about more than just taxes on cigarettes and alcohol? Or can it change the face of industry too? It took both David Fowler and Helen Knight to find out.
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Corning and Alcatel to share photonic technologies
30 May 2001
Corning, and Alcatel have signed a cross-licensing agreement for photonic components and fibres.
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Sharpening up the blur
30 May 2001
The conventional wisdom that a machine is only as good as its parts may no longer apply to cameras and other imaging devices.
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Goodrich to acquire Dana's industrial polymer bearings
29 May 2001
BFGoodrich is to acquire Dana Corporation's Glacier Industrial Bearings business and combine it with Goodrich's bearings business, known as Garlock Bearings.
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Hear me, see me
29 May 2001
OmniVision Technologies has released details of its OmniStar Cam, a miniature camera module targeted at 2 Gigahertz, 2.5G and 3G mobile phones.
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Pechiney plans to acquire Soplaril
29 May 2001
Pechiney and TotalfinaElf have entered the final phase of negotiations for Pechiney to acquire Soplaril, an Atofina subsidiary.
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Stacking it
29 May 2001
Tessera is working with Intel to develop advanced semiconductor packaging solutions for next-generation wireless and portable electronics products.
