Rohm and Haas Electronic Materials, CMP Technologies, which engages in chemical mechanical planarisation (CMP) technology for the global semiconductor industry, will build a pad manufacturing plant and technology centre at the
The Rohm and Haas Electronic Materials, CMP Technologies Asia Pacific Manufacturing and Technical Centre will encompass next-generation IC1000 polishing pad production, an applications lab and sales and customer support offices.
Expected to be in commercial production by the first quarter of 2007, the centre’s proximity to fabs throughout
Rohm and Haas Electronic Materials will invest $50 million in this manufacturing and technology centre located on six acres in the
The facility will include a 45,000-square-foot plant dedicated to advanced manufacturing technology for next generation CMP pads. The 20,000-square-foot technical centre is designed to be the most comprehensive laboratory for CMP consumables in
Full capability for 300 mm CMP polishing and post-CMP cleaning and associated metrology will be installed in Class 1 to 10 clean rooms of approximately 4,000 square feet. Equipment and instrumentation for pad and slurry product analysis as well as slurry blending capability will also be a part of the laboratory. CMP Technologies expects the facility’s staff to grow to greater than 150 members by 2010.
“We believe our proximity to the