AMD, Infineon Technologies and UMC today announced plans to collaborate on the development of common 65/45 nanometer (nm) manufacturing platform technologies for the high-volume production of semiconductor logic products on next-generation 300 millimetre wafers.
According to a joint statement, each of the three companies will supply engineering resources and expertise to jointly develop common platform technologies, which will then be tailored by each company to meet specific manufacturing and product requirements.
Initial work for the joint development program will take place at a UMC facility in Hsinchu, Taiwan. With this initiative, Infineon reportedly expands upon an existing agreement they have with UMC to develop 130/90 nm process technology and will join the process development program AMD and UMC announced earlier this year targeted for the 65 and 45nm nodes.
‘With the combination of Infineon’s 300mm commitment and outstanding R&D talents coupled, AMD’s leadership in transistor and process development and UMC’s process and manufacturing leadership, we are well positioned to be the first semiconductor companies to deliver advanced nanometer technologies on 300mm wafers,’ commented Robert Tsao, chairman of UMC.