Ashvattha Semiconductor, a provider of Radio Frequency (RF) chips for the wireless and handheld markets, has announced a technology its says will give it the ability to integrate multiple complete RF front ends on a single chip.
Initial silicon, integrating three separate complete RF front ends supporting wireless, GPS, and BlueTooth standards on a single chip will be manufactured by IBM using its Silicon Germanium BiCMOS process.
Initial applications for the device will be targeted at the cellular phone market.
‘Tomorrow’s mobile telephones will have to support multiple wireless technologies including Bluetooth and the Global Positioning System as well as cellular,’ said Jack Quinn, President of Micrologic Research, a wireless market research firm in Phoenix, AZ. ‘By making it possible to integrate the complete RF portion of these multiple protocols onto a single chip, Ashvattha’s technology will make cellular phones lighter, cheaper, and more compact.’