The Bosch Group is investing €550 million in the construction of a new manufacturing facility for 200mm semiconductors at its site in
The plant will have a total capacity of up to 1,000 silicon wafers per day, equivalent to a daily production volume of up to one million microchips. Bosch has been manufacturing 150mm semiconductors in
Semiconductor and micromachined chips from
The new Reutlingen plant will mainly be geared to the ‘small power process’, in which integrated circuits combine on one chip highly sensitive signal processing and high voltage circuits for the control of high-performance actuators. The chips must perform reliably under the especially tough thermal and mechanical loads experienced during driving.
The technology uses ultra-fine structures which are deposited on the chips. The structures will initially be 0.35 micrometres wide, but at a later stage, Bosch plans to halve structure width to 0.18 micrometres.
In addition, MEMS (Micro-Electro-Mechanical Systems) technologies are also to be rolled out in the 200mm wafer fabrication plant, to manufacture micromechanical sensors that are used in cars, mobile phones, PDAs and games consoles.