Qimonda has signed a new agreement with Winbond Electronics to extend their existing collaboration on the production of dynamic random access memory (DRAM) chips.
As part of the contract, Qimonda will transfer its 75nm and 58nm DRAM trench technology to Winbond’s 300mm facility in Taichung, Taiwan, and Winbond will manufacture computer DRAMs exclusively for Qimonda.
Munich-based Qimonda will also receive license fees and royalties for memory chips developed by Winbond using the 58nm technology.
The existing agreement covers the transfer and licencing of the Qimonda 110nm, 90nm and 80nm DRAM trench technologies to Winbond’s production sites.
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