DuPont Displays and the Japanese Semiconductor Energy Laboratory (SEL) are to jointly work on developing Active Matrix Polymer Organic Light Emitting Diode (AM Poly-OLED) display technology.
This emissive display technology will be based on the advanced Poly-OLED process technology developed by DuPont Displays’ wholly owned subsidiary UNIAX, and the poly-Thin Film Transistor (TFT) technology of SEL.
Poly-OLED technology claims to offer inherently superior performance versus incumbent displays, particularly for portable applications that require high switching speed, high contrast, increased brightness and low-power consumption. The use of TFT backplanes for Poly-OLED displays can further reduce power consumption, particularly in higher resolution devices.
The TFT technology of SEL offers improved electronic mobility compared to conventional Low Temperature Poly Silicon (LTPS) designs, and therefore enables smaller TFT transistor structures. This reduced TFT size allows the required row drivers, column drivers and controller systems to be directly integrated onto the backplane, significantly reducing the total thickness and cost of the finished display module.
On May 24th, DuPont Displays and Philips Components disclosed that they were also involved in a joint development agreement with Alien Technology, a start-up company based in Morgan Hill, CA . The aim of the tie up is to bring an Active Matrix Polymer OLED on plastic to market.
The three companies will explore the potential of Alien’s NanoBlock IC technology in the design of next generation Polymer OLED displays on glass substrates. The research will involve the development of smarter, passively driven full-colour Polymer OLED displays, as well as direct-drive displays. Unlike the conventional active matrix approach, direct-drive technology eliminates display refresh overhead through the use of local control, memory and drive circuits to service individual pixels.
Philips Components will combine its display expertise in the areas of module design, system design and glass processing with Alien’s advanced Fluidic Self-Assembly (FSATM) technology and NanoBlock IC design. The companies will also design and develop ‘smart’ backplanes for Polymer OLED applications.
The fundamental technology innovation in this development is the ability to embed precision current-source drivers and control electronics in plastic substrates using a low-cost, low-temperature process.