High performance thermal dissipation

Raychem’s Gel-Tek products provide thermal dissipation and environmental sealing solutions in electronic equipment used in remote locations.

HeatPath gap filler pad and thin interface materials are soft and conformable with low thermal resistance and compression force. Installed over a PCB, it conducts heat away from the package sides, leads and traces.

Raychem Interconnect Tel: 0800 968626 Fax: 01793 573863; Email: elecinfo@raychem.com; www.raychem.com