Hot chips

It is widely accepted that mechanical stresses due to temperature gradients and temperature cycling cause the majority of failures in today’s electronic systems. However, analysis is seriously hampered by the lack of standard methods to predict temperature gradients in time and space with sufficient accuracy. The European Commission has accepted a proposal for a three-year collaborative research project PROFIT to improve thermal design of electronics.

PROFIT aims to overcome these drawbacks through major improvements in experimental techniques to acquire better input data for thermal modelling via non-linear parameter estimation methods, and improved transient thermal characterisation of components. PROFIT is coordinated by Philips Research.

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