Infineon Technologies and LSI Logic Corporation have entered into a joint development agreement (JDA) to share existing intellectual property (IP), to jointly develop new IP and to collaborate on the design of integrated circuits for hard disk drive (HDD) applications.
The agreement, which allows each company to market System-on-Chip ICs developed individually or jointly, gives Infineon and LSI Logic access to all of the advanced functionality needed to meet requirements for desktop and mobile HDD products.
Infineon and LSI Logic expect that initial products resulting from the JDA will be available beginning in second half 2003.
‘The LSI Logic-Infineon R&D cost-sharing agreement is expected to expand the market opportunities for both companies in the hard-disk drive space, while bringing time-to-market advantages to customers,’ said Dave Reinsel, Research Manager, Storage, Hard Disk Drives and Components, IDC. ‘The agreement also enhances the competitive position of both companies in this global market and provides their customers with the benefits of the combined intellectual property strengths of these two technology leaders.’
These technologies include Infineon’s recently-announced 1.6 Gb/sec read channel, SERIAL-ATA and Fibre Channel interfaces based on LSI Logic’s GigaBlaze transceiver core technology, 10 bit Error Correction Code and processor subsystem IP.
Access to these IP blocks is said to enable both parties to address all the IP needed to meet the requirements of the enterprise, desktop and mobile HDD markets for integrated read channel and serial interface system-on-a-chip (SOC) devices.
‘Providing low-cost, high-performance interfaces for storage applications is key for this industry,’ said Peter Schiefer, general manager and vice president, Business Unit Network and Computer Storage, Infineon Technologies.
‘We are blending LSI Logic’s interface and system-level integration leadership with Infineon’s high-data-rate read channel expertise, and combining our companies’ engineering resource efforts to achieve SOC integration. This, along with our advanced high-volume manufacturing capabilities, will give our customers an edge in today’s highly competitive time-to-market business,’ he added.