Joint venture boosts chip output with larger wafers

Semiconductor300, the joint venture between Infineon Technologies and Motorola, has developed a technique to boost the number of chips which can be produced on a single wafer. The joint venture reports that its 300mm wafer pilot plant in Dresden, Germany, has beaten the yields (the precentage of usable chips on a single wafer) given by […]

Semiconductor300, the joint venture between Infineon Technologies and Motorola, has developed a technique to boost the number of chips which can be produced on a single wafer.

The joint venture reports that its 300mm wafer pilot plant in Dresden, Germany, has beaten the yields (the precentage of usable chips on a single wafer) given by conventional 200mm manufacturing lines.

The breakthrough follows Semiconductor300’s announcement that it had produced a chip processed on 300mm equipment.

Pressure to improve manufacturing volumes has driven the semiconductor industry towards using larger diameter wafers.

The Dresden pilot plant has produced 300mm wafer test yields greater than 60%. Taking into account the larger wafer size this represents almost one and a half times the total number chips that can be produced using a 200mm wafer.

The wafers being used in the Dresden pilot produced 64 megabytes DRAMs with a geometry of 0.25 micro m. The disadvantage of 300mm wafers is that tooling in 200mm wafer plants has to be altered. Each wafer, almost one foot in diameter, is more difficult to handle.