Royal Philips Electronics has introduced a new range of Power MOSFETs in a new miniature package dubbed QLPAK.
The QLPAK occupies the same 6mm x 5mm printed circuit board (PCB) area as a conventional SO8 package, but is thermally superior.
QLPAK has a thermal resistance of 1.5K/W compared to the SO8 package, which typically has a thermal resistance in excess of 20K/W.
QLPAK is also approximately 50% thinner than the current SO8 package yet is footprint compatible.
Philips’ QLPAK is currently sampling. Volume production will begin in August 2002.