Consumer portable electronics will benefit from a 70 percent reduction in size from the SC-70 (DCK) logic package size with the introduction of NanoStar packaging, announced by Texas Instruments.
The first devices available in NanoStar packaging will offer the most popular logic functions for space-constrained systems such as wireless handsets, pagers, personal digital assistants, portable DVD players, MP3 players, notebook computers and other portable consumer electronics.
NanoStar packaging will be first introduced in a 5-pin, Single-Gate, Low-Voltage CMOS (LVC) technology. LVC Dual Gate devices will follow in an 8-pin version. These Little Logic devices operate at 1.8-V, and are optimised at 3.3-V, providing low power consumption and medium current drive capability.
With a footprint of 1.40mm by 0.9mm by 0.50mm = 1.26mm2, NanoStar packaging offers a 13 percent reduction in size from any other alternative logic package solution and a 70 percent reduction over TI’s previous single gate package, SC-70.
Designers will also realise improved thermal performance with the new NanoStar package over the SC-70. This improved thermal performance benefits designers concerned with heat dissipation common in small, portable electronics. NanoStar packaging is a leadless package option that makes use of five eutectic solder balls. With a ball pitch of 0.5mm, these self-planarising balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.
The first products in NanoStar packaging are sampling now with volume production scheduled for the fourth quarter of 2001. Estimated resale pricing is $0.25 for quantities greater than 50,000 in 3,000 part reels.
NanoStar packaging is fully supported with technical documentation including a NanoStar Packaging Design Summary and Little Logic Selection Guide located on-line at www.ti.com/sc/nanostar