Intel Corporation and Mitsubishi Electric will co-develop a cellular chipset for the third-generation (3G) wireless technology market.
Intel and Mitsubishi will work together to develop and market the new chipset and associated software as Japan deploys 3G wireless technology. Work on the chipset has begun, and the companies intend to expand their joint development effort to other geographic regions using the same platform architecture.
‘Using Intel’s wireless solutions, Mitsubishi can develop a high-performance, low-power and highly integrated multimedia 3G cellular phone. Japan is our initial focus market, and we expect to use the same architecture platform for Europe and other regions in a timely manner,’ said Michio Nakanishi, group president of the Communication Systems Group, Mitsubishi Electric Corporation.
Intel are at www.intel.com. Mitsubishi Electric are at www.mitsubishielectric.com.