TI and Microsoft have solution in hand

Texas Instruments and Microsoft have unveiled an integrated wireless solution designed to support next generation (2.5G), GSM/GPRS-enabled wireless handsets and advanced mobile computing devices.

Based on Microsoft’s smart phone platform (code-named Stinger) and TI’s digital signal processor (DSP)-based GSM chipset technology, this solution will deliver broadband-enabled wireless applications to consumers, such as secure e-commerce, mobile Internet access and corporate e-mail, with greater performance and longer battery life.

TI’s 2.5G smart phone solution integrates its programmable DSP-based digital baseband processor with its application processor to run Stinger-based applications. As future wireless data bandwidth increases from 2.5 to third generation communications (3G), this solution provides compatibility with TI’s future DSP-based Open Multimedia Applications Platform (OMAP) products.

Compatibility with future OMAP architectures will provide original equipment manufacturers (OEMs) and applications developers with increasing levels of performance and battery efficiency, without having to constantly redesign existing software applications for new hardware architectures.

TI’s integrated baseband and applications processor will be complemented with its integrated analog, power management and radio frequency (RF) products.

The Microsoft smart phone platform seeks to combine the best features of the personal digital assistant (PDA) with the best of the mobile phone, integrating voice capability and personal information management in a mobile phone. The TI integrated chipset is sampling today, with volume production in the 2H of 2001.

More at www.ti.com