Wireless chips

Fujitsu Microelectronics America is to co-develop systems-on-chips for broadband wireless applications with Wi-LAN, a developer of broadband wireless communications products.

Fujitsu Microelectronics America (FMA) is to co-develop systems-on-chips (SoCs) for broadband wireless applications with Wi-LAN, a developer of broadband wireless communications products.

Under the terms of a recently signed non-exclusive agreement, Wi-LAN will combine its expertise in Wideband Orthogonal Frequency Division Multiplexing (W-OFDM) technology with FMA’s ASIC design capabilities to integrate embedded processors and mixed signal technology into SoCs.

The two companies will jointly create a broadband wireless-access subscriber-station device for a range of business and individual users.

Wi-LAN and FMA are presently working on proprietary W-OFDM SoCs based on Wi-LAN’s BWS 3000 Series products, which began shipping on October 31, 2001.

The next step is collaboration on SoCs built around the IEEE 802.16a draft standard. FMA will market the SoCs and related products.

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