Chipset delivers TDM over Ethernet

Teknovus has announced a new family of EthernetPlus chips that deliver time division multiplex circuits over standard point-to-point Ethernet links.

Teknovus has announced a new family of EthernetPlus chips that deliver time division multiplex (TDM) circuits over standard point-to-point Ethernet links. The TK3501 is the first chip available from this family and supports up to four T1/E1 circuits over 100 Mb/sec Ethernet links.

A key benefit of the EthernetPlus chip family is that it allows telecommunication service providers to deliver both IP data and TDM services over a common Ethernet platform, with the same quality as more expensive TDM networks. Several access equipment vendors have qualified the product for use in their equipment, including TTC Group and Allied Telesyn.

Sean Tan, Product Manager for Allied Telesyn says ‘Until we saw the Teknovus chipset, we were skeptical that it was possible to enable T1/E1 functionality over a cost-effective data infrastructure. But the EthernetPlus chipset delivers TDM traffic over Ethernet at prices that will help us improve the value proposition of our products.’

Unlike currently available in-band techniques, which require complex timing and traffic management to deliver TDM traffic over Ethernet, the Teknovus EthernetPlus chips deliver dedicated out-of-band circuits on standard Ethernet connections. This approach ensures quality of service but is simpler and much lower cost, according to the company.

EthernetPlus is designed for use in a wide range of fibre access equipment, including fibre-to-the-business (FTTB) and fibre-to-the-home (FTTH) optical network terminals (ONTs), Ethernet media converters, broadband SONET aggregation platforms, and a variety of Ethernet customer premise equipment (CPE). Applications for EthernetPlus include a range of T1/E1, DS3/E3, ISDN, high-speed data and management services.

TTC Group CEO, Thomas Su says, ‘Teknovus solves a key problem – how to handle the rapid growth in IP data traffic without compromising the legacy TDM services that are still the bulk of carrier revenues. Now, our carrier customers can enable simultaneous transport of revenue-critical T1/E1 circuits over standard Ethernet links.’

Evaluation Kits for the TK3501 chipset are available for delivery. The devices are in 100-pin LQFP packages with dimensions of 14 mm x 14 mm.

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