Multi-chip package products empower new generation

Toshiba has announced new multi-chip package products which have five and six chips stacked inside ball grid array packages to create single 9mm x 12mm x 1.6mm components.

Toshiba America Electronic Components (TAEC) has announced new multi-chip package (MCP) products which have five and six chips stacked inside ball grid array (BGA) packages to create single 9mm x 12mm x 1.6mm components.

Toshiba will develop five and six-chip MCPs with various combinations of NOR flash, NAND flash, Static RAM (SRAM), and Pseudo SRAM (PSRAM) to meet the complex memory requirements of digital camera phones and feature-rich 3G cell phones.

As additional features and applications have been added to cellular telephones, such as Internet browsing, text messaging, games, and digital camera functionality, memory requirements for these feature-rich phones have become increasingly complex.

Tradeoffs in density, speed, cost and power are said to make combinations of several different types of memory desirable in cell phones. According to TAEC, cell phone designers typically prefer NOR flash memory for code storage; low-power SRAM or fast, cost-effective PSRAM for working memory, and are now turning to NAND flash for additional application and data storage because of its low cost-per-bit.

Toshiba’s new five-and six-chip stacks are said to be able to provide a combination of three or four types of memory in densities targeted to meet the needs of such feature-rich phones.

A broad selection of Toshiba’s NOR flash, NAND flash, low-power SRAM and PSRAM is available for multi-die MCP configurations. Specific combinations of five or six die for high volume applications of interest will be reviewed by Toshiba for technical feasibility.

‘These new MCPs can provide a complete, versatile memory subsystem with multiple types of high density memories in the space of a single component, helping to address the design challenge to provide higher density, higher performance memory, at a lower cost and in a smaller space,’ said Scott Nelson, director of business development, Flash Memory Business Unit, for TAEC.

‘For high-volume applications, Toshiba will offer custom configurations that combine various combinations of five or six NOR flash, SRAM, PSRAM and NAND flash die. In addition, we will continue to offering existing MCP products which have two, three and four stacked chips,’ concluded Nelson.