Amkor forms China test alliance with UTAC

Amkor Technology has entered into a business alliance with United Test and Assembly Center Ltd aimed at creating an assembly and test supplier capable of supporting Chinese wafer foundries.

Amkor Technology, Inc has entered into a business alliance with United Test and Assembly Center Ltd aimed at creating an assembly and test supplier capable of supporting Chinese wafer foundries as well as IDM’s looking to service their end customers in the Chinese market.

As part of the alliance, UTAC (Shanghai) Co. Ltd. is entering into a multi-year lease agreement to locate its China test centre within Amkor’s existing factory in the Waigaoqiao Free Trade Zone in Shanghai.

The test centre will be equipped with multiple test platforms including the Agilent 93K, Teradyne J750 and Advantest 5581. According to Amkor, these test platforms will be suitable for testing a wide range of device technologies including mixed signal, digital and memory devices. The centre will provide a complete range of test services including wafer probe, burn in, final test and all related back end services.

‘Chip companies operating in China are increasing their design and manufacturing competencies while also striving to reduce time to market. We believe that having access to world-class assembly and test resources will be a key enabler for the development of China’s semiconductor industry,’ said John Boruch, Amkor’s president and chief operating officer.

‘We are pleased to join forces with Amkor in a mutual effort to capitalise on what should be extraordinary long-term growth opportunities to support the emerging Chinese semiconductor industry,’ said J.C. Lee, President and CEO of UTAC Co. Ltd.

‘By combining our critical mass in IC test technology with the world leader in outsourced chip packaging, we offer the China market a strong set of turnkey assembly and test capabilities,’ added Lee.

On the web