Thinner embedded capacitance material

3M announced yesterday that it has developed one of the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards.


3M announced yesterday that it has developed an improved embedded capacitance material that has a dielectric thickness of eight microns and a capacitance density over 11 nanofarads per square inch.


3M said the product is among the thinnest and highest capacitance density materials available for embedding planar capacitance in circuit boards. Fabricators and OEMs worldwide can use this material without a license from 3M.


“Using embedded capacitance for decoupling high-speed electronics offers many benefits, such as improved noise margins, faster signalling, less-radiated emissions and reduced capacitor counts,” said Bill Balliette, new business development manager, 3M Electronic Solutions Division. “This thinner laminate gives design engineers more space to work with.”


According to a statement, the 3M laminate material allows designers and manufacturers of high-speed digital printed circuit boards to achieve higher speeds while simplifying design tradeoffs.


When used as a power-ground core in a multilayer printed circuit board, 3M embedded capacitor material effectively becomes a decoupling capacitor inside the board. The material allows designers to eliminate large numbers of decoupling capacitors, increases useable board area, enables faster signalling, lowers radiated emissions (EMI), and saves engineering time associated with power distribution design and board layout.


3M is supplying samples in limited quantities to select OEMs and fabricators for initial testing. The company will be exhibiting at the IPC Printed Circuits Expo, February 22-24, 2005, at the Anaheim Convention Center in Anaheim, California, in Booth 1549.



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