The expanded relationship covers current, emerging and next-generation wireless standards and leverages intellectual property from Motorola and TI.
As part of the expansion, Motorola is developing 3G handsets based on a TI customised 3G solution that will include processors from TI’s OMAP 3 architecture, as well as 3G and 3.5G building blocks from Motorola and TI. New handsets using this solution are expected to be available to consumers by 2008.
Additionally, TI is supporting Motorola’s mobile WiMAX initiative, including development of a customised Motorola WiMAX solution, and providing digital design elements, high-performance analogue components, RF solutions, and manufacturing process and fabrication expertise. The solution will focus on core 802.16e mobile WiMAX functionality supporting voice, video and data for low-power mobile applications. The solution will be manufactured in 65nm and is expected to be ready to support production of new mobile devices that Motorola plans to launch during 2008.
‘Motorola is working aggressively to design and deliver the world’s most comprehensive portfolio of mobile devices that unite market-leading “must have” design with fully optimised and unmatched “must do” experiences,’ said Ron Garriques, executive vice president of Motorola and president of Motorola’s Mobile Devices business.
To meet the growing need for affordable multimedia-rich capabilities in handsets, Motorola has also selected solutions from TI’s OMAP 2 and OMAP 3 product portfolio and OMAP-Vox family, including the OMAPV1035 GSM/GPRS/EDGE single-chip solution from the “eCosto” platform and the OMAPV1030 GSM/GPRS/EDGE chipset.
Motorola plans to use the OMAPV1035 solution, which leverages TI’s DRP technology, in new low-cost multimedia mobile devices expected to be in the market in 2008. Motorola also plans to use the OMAPV1030 chipset in new mid-range multimedia mobile devices expected to be in the market later this year.