Joint programme bent on acceleration

The University at Albany and International SEMATECH have completed negotiations on a joint program to accelerate the development of next generation lithography.

The University at Albany (UAlbany), New York and International SEMATECH (ISMT), the global consortium of semiconductor manufacturers, have completed negotiations on a joint five-year program to accelerate the development of next generation lithography.

Under the terms of the contract, ISMT will conduct a program in EUV (extreme ultraviolet) lithography infrastructure, focused on advanced work in three areas – mask blanks, resist and EUV extensions – at UAlbany’s new 300 mm wafer cleanroom complex.

According to Kevin Kemp, EUV program manager for ISMT, the EUV infrastructure program to be conducted at UAlbany will complement and expand on the work being done at ISMT’s headquarters in Austin, Texas.

The UAlbany/ISMT agreement stipulates that ISMT will provide technical program definition, execution, management and staffing, while UAlbany will provide facilities, staffing and funding leverage.

Both entities will share in the executive management of the program and the procurement of equipment, materials and contract R&D as defined by the ISMT management team.

Initially, ISMT will send a small project team of about 10 people to Albany to oversee the start-up. Ultimately, the program is projected to include 30 ISMT employees and assignees, and involve over 500 UAlbany and other university faculty and staff, national laboratory and industry scientists and researchers, material and equipment supplier engineers and technicians.

‘We’re ready to launch this program,’ said Kemp. ‘Our first tools will arrive in February, and our staff is set to hit the ground running.’

‘And we’re ready to receive the ISMT team and launch a long and fruitful partnership that will generate an excellent return on our mutual investment,’ stated Alain E. Kaloyeros, executive director of Albany NanoTech of the University at Albany.