Finer flat chip fuses

Vishay Intertechnology has announced the release of three new devices in the MFU series of thin film flat chip fuses that offer quick-acting fuse characteristics with rated current values up to 5.0 A.


Vishay Intertechnology

has announced the release of three new devices in the MFU series of thin film flat chip fuses that offer quick-acting fuse characteristics with rated current values up to 5.0 A as well as stability verified in accordance with UL 248-14 and IEC 60127-4.

The Vishay Beyschlag MFU 0603 and MFU 0805 devices are rated for a current range of 0.5 A to 4 A. However, the MFU 1206 devices feature rated current values up to 5.0 A. Rated voltage is 32 V for the MFU 0603 and MFU 0805 and 63 V for the MFU 1206. At these rated voltages, the devices provide a breaking capacity of 50 A.

The new MFU 0603, MFU 0805, and MFU 1206 are designed to provide secondary overcurrent protection for power inverters, motion-control units, dc-to-dc converters, battery chargers, and low-voltage power supplies in information technology, telecommunications, automotive, medical, and audio and video systems.

Available in standard metric case sizes – RR 1608M (1.55 mm by 0.85 mm by 0.45 mm) for the 0603 chip fuse, RR 2012M (2.0 mm by 1.25 mm by 0.45 mm) for the 0805 chip fuse, and RR 3216M (3.2 mm by 1.6 mm by 0.55 mm) for the 1206 chip fuse – the thin film flat chip devices integrate into a broad range of end products.

Vishay says that a highly controlled manufacturing process, combined with the company’s advanced thin film technology, is said to yield very quick-acting fuse characteristics for highly predictable performance even in sensitive electronic systems.

Vishay further claims that an extensive testing procedure is performed on every device, each of which features a coating that protects against electrical, mechanical, and climatic hazards. The MFU 0603 and MFU 0805 are certified by the Underwriters Laboratory, and both are listed under UL E253806.

The MFU 0603, MFU 0805, and MFU 1206 support lead-free soldering and are suitable for processing on automatic SMD assembly systems using wave, reflow, or vapor phase processes. The terminations for the new lead-free MFU chip fuses are pure tin on nickel plating. The immunity of the plating against tin whisker growth is said to have been proven under extensive testing. All products comply with the CEFIC-EECA-EICTA list of legal restrictions on hazardous substances.

Samples and production quantities of the new thin film flat chip fuses are available now, with a lead time of 8 to 10 weeks for larger orders.