Fairchild Semiconductor has introduced a synchronous buck converter chip set designed specifically to optimize efficiency and space in notebooks using the latest IMVP (Intel Mobile Voltage Positioning) specifications.
The FDS6299S device’s monolithic SyncFET technology eliminates the need for an external Schottky diode, resulting in board space savings and reduced assembly costs.
This integrated chip set features a very low Qgd or “Miller” charge for fast switching speeds as well as a Qgd / Qgs ratio of less than 1 to limit the potential for cross conduction losses. In addition to Vcore designs, the fast-switching FDS6298 and the low RDS(on) FDS6299S offer benefits as a matched pair that are suited for high current point-of-load (POL) converters in such applications as high-end communications equipment.
Key performance characteristics of the FDS6298 (high-side) MOSFET include:
- Low total Qg (9nC @ VGS=4.5V) and Qgd (3nC @ VGS=4.5V) for fast-switching speeds to increase efficiency;
- Optimized die and lead frame design to reduce package resistance and inductance, reducing conduction and source terminal inductance switching losses; and
- Rg-specified and 100% Rg-tested resulting in a well-defined drain-source switching characteristic.
Key performance characteristics of the FDS6299S (low-side) MOSFET include:
- Low RDS(on) (3.9mOhm (max) @ VGS = 10V) to reduce DC losses;
- Low body diode loss (low QRR and low forward voltage drop) to improve efficiency;
- Soft-recovery characteristic to lower noise, and low Crss to reduce the potential for cross conduction; and
- Low total Qg (31nC @ VGS=5V) for reducing gate drive requirements.
The products are available in a lead (Pb)-free SO-8 package that meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020B and are compliant with the European Union requirements now in effect.
Details of the products can be found online at: