DuPont and Cheil form SD Flex

DuPont and Cheil Industries have signed a 50/50 joint venture agreement to establish SD Flex, a company that will manufacture DuPont Pyralux adhesiveless, flexible copper clad laminate.

DuPont Electronic Technologies and Cheil Industries, part of the Samsung Group, have signed a 50/50 joint venture agreement, pending local and government approvals, to establish SD Flex Company.

SD Flex Company will manufacture DuPont Pyralux adhesiveless, flexible copper clad laminate (FCCL), the material instrumental in enabling advanced functionality and performance in displays, cell phones, personal digital assistants (PDAs) and other electronic devices.

The manufacturing facility for SD Flex Company will be constructed at Cheil’s existing site in Gumi, Korea. The first manufacturing line within the new facility is expected to be operational in the third quarter of 2005 with an initial capacity of 100,000 square metres per month. SD Flex Company will focus on serving primarily the Korean market.

SD Flex Company will focus on advanced cast-on copper clad laminate manufacturing technology licensed from DuPont Wirex. According to DuPont, this technology reduces the layers in a flexible circuit from three to two, by eliminating an adhesive layer that prohibits maximum circuit density and flexibility and is often a cause of vulnerability to circuit failure.

Two-layer cast-on copper technology is said to enable more reliable, lighter and thinner devices and allows for extremely dense circuitry to carry more information faster. The global market size of adhesiveless FCCL was estimated to be over $300 million in 2003. The annual growth rate is estimated at 35-40 percent, fuelled primarily by demand for cell phones and displays.