Harwin has introduced a range of surface mount EMI/RFI shield clips which reduce assembly time and simplify rework by eliminating secondary soldering operations. Supplied industry standard tape & reel packaging, Harwin’s RFI shield clips are positioned on the board and soldered using standard SMT placement equipment. The shielding can is then pushed into place

during final assembly. Because it is possible to remove and refit the can adjustment and rework operations are simplified and initial production and rework costs are reduced.


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