Dow Corning has signed a joint development contract with INVINT Limited, a Scottish-based specialist in conductive polymer interconnect technology.
Founded in 2003, INVINT boasts intellectual property (IP) that relates to the direct ablation of conductive materials to form printed circuits on a number of substrates. The company aims to bring its IP to market as a process ‘encapsulated’ in the hardware and materials of key partners such as Dow.
Under the development contract, INVINT will develop and characterise novel interconnect processes based on new Dow Corning conductive polymer products, including both organic- and silicon-based materials.
Conductive polymer materials are increasingly being used in a wide range of interconnect applications, from cell phones and smart cards to military and automotive electronics.
The conductive polymer market is expected to see significant growth over the next few years, with demand in the United States alone increasing 5.9 percent annually to become a $4.5 billion market in 2008, according to market researcher The Freedonia Group.