TDK makes combination mobile chip

TDK Corporation has developed a series of multilayer chip electromagnetic interference filter arrays with electrostatic discharge countermeasure functions designed for mobile phones.


TDK Corporation has developed a series of multilayer chip electromagnetic interference (EMI) filter arrays with electrostatic discharge (ESD) countermeasure functions designed for mobile phones.



These new chip products combine the noise countermeasure functions of earlier EMI filter arrays with functions that protect circuits from static electricity. Mass production of the compact chip is scheduled to start in November 2006.



Mobile phones frequently use EMI filters as countermeasures against noise on the line. In recent years, there has been an increasing need for countermeasures that prevent mobile phone malfunctions caused by electrostatic discharge (ESD) from the human body. At the same time, smaller phones and an ever-increasing number of functions have resulted in space limitations on circuit boards.



In response, TDK developed these new filter arrays as compact components that incorporate ESD countermeasures and noise countermeasures in a single chip. One chip can provide EMI and ESD countermeasures for four signal lines and has the ESD-resistance characteristics of an 8kV contact.