Lockheed Martin and Singapore’s Nanyang Technological University (NTU) have signed a memorandum of understanding to explore nanocopper and related technologies for the commercial market.
Lockheed Martin and NTU will set up a joint research laboratory at NTU’s Yunnan campus.
The lab will allow NTU students and faculty to work with Lockheed Martin scientists on developing CuantumFuse solder.
The material was developed by Lockheed Martin Advanced Technology Center and is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to similar tin-based materials.
The NTU-Lockheed Martin Joint Laboratory will have an initial fund of $10m over the next four years, and will employ up to eight scientists working on collaborative research projects.