Packaging MEMS

Coventor has released its CoventorWare 2004 software, adding new modelling and analysis capabilities that go beyond isolated MEMS device design to assist engineers involved in MEMS product development and manufacturing.

Coventor has released its CoventorWare 2004 software, adding new modelling and analysis capabilities that go beyond isolated MEMS device design to assist IC designers, package designers and process engineers involved in MEMS product development and manufacturing.

The new software is complementary to EDA tools offered by Cadence and Synopsys to build MEMS integrated IC designs.

CoventorWare consists of four products to create, model, analyze and integrate MEMS devices: Architect, Designer, Analyzer and Integrator. Typical MEMS devices are categorized as sensor, actuator, RF and microfluidic MEMS.

In the new release, new components have been added to the Architect library including new beam actuator models for modelling thermally or Piezoelectrically actuated devices such as mirrors, and membrane models for modelling pressure sensors.

CoventorWare 2004 is complemented by MEMulator 2004, another new product that emulates a wide range of MEMS and semiconductor fabrication processes. Designers and process engineers can save fabrication cycles by using MEMulator to build 3D virtual prototypes before undertaking actual fabrication.

This week, Japanese ceramic packager Kyocera disclosed that it had teamed up with Coventor to develop and market CoventorWare software that contains material and design data of Kyocera’s standard ceramic packages.

The new software will enable MEMS device designers to simulate the behavior of coupled MEMS device with the package in the developmental stage, reducing package development time and costs, which are said to be as high as 45% of total MEMS device development costs.

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