Chinese memory chip supplier Qimonda is to expand its facility for the assembly and testing of memory integrated circuits in the
Qimonda will construct a second building doubling the factory’s capacity. Investment in construction of new facility, including infrastructure, production equipment and IT, will amount to around €250m over the next three years.
Construction of the new facility is scheduled to begin in March 2007, with the site ready for equipment installation by late 2007. A new clean room of 10,000m2 will be added to the existing clean room of the same size. The expansion will also result in a significant increase in staff.
Qimonda uses five 300mm manufacturing sites on three continents and currently uses four sites for back-end manufacturing. In addition to
The back-end manufacturing process comprises of two major steps. Firstly, the processed wafers are diced into individual chips and, after interconnecting pins are added, the chips are encapsulated into a packaged component using a compound material. After testing, components are often soldered onto circuit printed boards to create modules.