R&D alliance

Freescale Semiconductor and IBM today announced that Freescale will join the IBM technology alliance for joint semiconductor research and development.

The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design at the 45 nanometre generation.

Freescale is the first technology development partner in the IBM technology alliance to participate in low-power and high-performance technology research and development.

According to a statement, the alliance will enable Freescale to strengthen its manufacturing strategy. In addition to leveraging owned capacity in internal fabs and its existing relationships with leading foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM’s Common Platform partners.

The Common Platform provides its semiconductor fabrication partners with synchronised manufacturing processes to help ensure the maximum flexibility and lowest development investment for multi-source, high volume manufacturing.

‘Freescale’s addition to the IBM technology alliance is a significant vote of confidence for IBM’s collaborative model and the work we are doing jointly with our technology partners,’ commented Lisa Su, vice president, Semiconductor Research and Development, IBM. ‘Freescale will be a valuable addition to our team, with its deep expertise in semiconductor process development and fast growing embedded applications, like automotive, networking and wireless.’