Second LCD line for Shenzhen

DuPont has begun construction on a second production line for liquid crystal display (LCD) direct bonding in Shenzhen, China.

According to a statement, the new line, which will more than double the company’s direct bonding production capacity and clean room space in the region, is in response to increased demand for affordable direct-bonded products such as tablet personal computers (PCs) and marine electronics.

Combining a proprietary adhesive with a cost-effective lamination process, DuPont direct bonding technology consists of bonding an anti-reflective glass or filter element directly onto the front of an LCD.

The technology is said to increase a display’s durability and readability, particularly outdoors in bright sunlight, by over 300 percent. It also eliminates the condensation that occurs when a glass coverplate is used, and improves the display’s resistance to scratching, stains and dirt.

“We opened our Shenzhen facility last year as part of a larger DuPont investment strategy in China, with the goal of bringing our established direct bonding technology for avionics, military and other specialized applications to display manufacturers for the consumer market,” said Peter Compo, managing director of DuPont Displays. “Customer response was very positive, and we are now adding the capacity required to keep pace with market demand for our technology.”

Direct bonding has been used in specialised avionics and military applications for decades, but was commonly considered too costly to employ in consumer products. With its improved operating efficiencies and close proximity to manufacturing partners, the DuPont Shenzhen facility has made direct bonding a viable option for consumer applications and available for widespread adoption of the technology.

Opened in 2005, the first DuPont direct bonding production line in Shenzhen was the first of its kind in Asia. The second line, scheduled for startup in the fourth quarter of 2006, will be located at the same facility and will more than double the company’s regional direct bonding capabilities. Continued growth is anticipated with plans to launch a third line in 2007.