ICOS Vision Systems Corporation, a supplier of inspection solutions for the semiconductor industry, today announced it has acquired the wafer inspection business of Siemens for 6.25 million Euros.
Under the terms of the agreement, ICOS will acquire the rights to all of Siemens’ two dimensional (2D) wafer inspection technology, as well as the assets related to the wafer inspection business.
The wafer inspection systems that are developed by Siemens’ Corporate Technology contain advanced wafer handling and image acquisition features and are capable of detecting defects down to 0.2 microns, making them suitable for back-end and front-end wafer level inspection up to 300mm wafer sizes.
“With this acquisition, ICOS is entering into the market for 2D wafer surface inspection systems, expanding our addressable market in back-end processes and penetrating front-end manufacturing,” said Anton DeProft, president and chief executive officer.
“Since multiple systems have been installed at pilot customers, the acquired technology is ready for commercialisation. We plan to integrate our own developed 3D inspection capability into the acquired systems in order to address the segment of the market that demands a combination of 2D and 3D wafer inspection systems,” added DeProft.