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Acromag has introduced the I/O Server Industrial PC featuring an internal carrier card to interface a selection of related plug-in I/O modules.

Designed to work together, this combination of a rugged, fanless box computer and conduction-cooled I/O modules provides an integrated system for high-performance measurement and control projects.

The first release in the I/O Server line, the Model IOS-7400, is equipped with an Intel Atom CPU and a range of interface connections for peripherals and network devices.

Users can insert up to four mezzanine IOS modules, in any mix, onto the slide-out carrier card to perform A/D, D/A, discrete monitoring/control, counter/timer, serial communication and FPGA computing functions.

The interface for up to 192 channels of field I/O is handled through four high-density connectors on the front panel for clean, easy cable access.

Advanced thermal technology removes heat without open vents or fans for dependable operation from -30 to 75C.

Applications include: machine control and factory automation applications; military and homeland security systems; rail and trucking; outdoor signage and display systems; and for research, simulation, data acquisition, and test and measurement projects.

The IOS-7400 PC unit features an embedded Intel Atom N270 1.6GHz CPU with 1GB of DDR2 RAM that runs on Windows Embedded Standard or Linux.

Standard interfaces include VGA graphics, two Ethernet ports, two serial ports, four USB ports, a Compactflash slot and audio input/output jacks.

An internal 2.5in PATA hard disk or solid-state drive is accommodated as a user-installed option.

More than 20 IOS modules are available to provide a variety of analogue, digital and serial I/O processing capabilities.

A reconfigurable FPGA module allows users to execute custom logic routines and algorithms on TTL, differential or LVDS I/O signals.

Up to four IOS modules can be combined in any mix on the carrier card for flexible, high-density I/O to meet custom requirements.

The IOS modules employ advanced heat-sink techniques to manage excessive heat.

A thermal pad wicks heat away from the module and transfers the energy to a conductive cover that contacts a large heat spreader plate within the I/O Server unit.

Heat then moves to the enclosure walls where it is dissipated by external cooling fins.

To simplify software development, Acromag offers several programmer support tools.

A Windows development package provides API development software and Win32 DLL drivers, plus examples for C, Visual Basic, .Net and Labview environments.

The Linux software includes a library of I/O function routines to speed code development.

Both packages include demonstration programs with C source code to test and exercise the I/O module operation.

I/O Server units have a rugged, extruded aluminum enclosure that is suitable for hostile industrial environments, common in manufacturing, defence, transportation and research applications.

These units are resistant to shock (5g) and vibration (50g).

Thermal management eliminates the need for vents or mechanics that could permit contaminants to enter or moving parts to fail.

As a result, an I/O Server with four IOS modules operates reliably across temperature ranges between -30 to 75C (-22 to 167F) with 0-90 per cent relative humidity, non-condensing.

Acceptable storage temperatures range from -40 to 85C (-40 to 185F).

FCC compliance meets FCC Part 15, Subpart B for Class A digital devices.

The power supply requirement is 9-32V DC +/-10 per cent at 60W maximum.

Power usage depends on the I/O modules used but is typically about 30W.

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