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Aries Electronics has expanded its Fine Pitch Bump Adapter range to include adapters that accommodate boards with pitches down to 0.4mm.

As part of the Correct-A-Chip series, the new Fine Pitch Bump Adapter range allow customers to use higher-pitch devices on smaller pitch boards.

The adapter tops have landing pads that can be designed to accept any device on any pitch and to settle into fine-pitch footprints, including thin-shrink small-outline packages (TSSOPs) and quad flat packages (QFPs) with pitches down to 0.4mm.

In addition, the adapter bottom has raised connection pads up to 0.010in (0.25mm) that facilitate the mounting of the adapter to the target board.

As a result of the open space now available on the top of the adapter board, manufacturers can add components to the design at a minimal cost.

The Fine Pitch Bump Adapter range saves users money by integrating higher-pitch BGA devices with boards laid out with smaller pitches that typically could not be used together.

Fine Pitch Bump Adapter boards are 0.062in-thick FR4 or Rogers 370 HR, with 1oz (28g) copper traces on both sides.

The non-solder mask-defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG).

The apparatus can operate up to 221F (105C) for FR4 and 266F (130C) for lead free.

The new adapters are available in tape and reel for high-speed SMT assembly and can be manufactured for RoHS compliance.

Standard line and trace spacing down to 0.003in (0.076mm) can be used.

Adapters are available in panelised form, as an adapter only, or as a turnkey solution with devices mounted.

Pricing for a typical application starts at USD15 (GBP9) per adapter in quantities of 100.

Delivery is three to four weeks after receipt of order.

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