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Aries Electronics has expanded its line of Fine Pitch Bump Adapters to include adapters that accommodate boards with pitches down to 0.40mm.

As part of the Correct-A-Chip series, the Fine Pitch Bump Adapters allow customers to use higher-pitch devices on smaller-pitch boards.

The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine-pitch footprints, including Thin-Shrink Small Outline Packages (TSSOP) and Quad Flat Packages (QFP) with pitches down to 0.40mm.

The adapter bottom has raised connection pads up to 0.010in (0.25mm) that provide easy mounting of the adapter to the target board.

Fine Pitch Bump Adapters save users money by integrating higher pitch BGA devices with boards laid out with smaller pitches that typically could not be used together.

Boards are 0.032in (0.813mm) thick FR4 or Rogers 370 HR, with 1/2oz copper traces on both sides.

The non-solder mask-defined (NSMD) pads are finished with electroless-nickel-immersion gold (ENIG).

The apparatus can operate up to 221F (105C) for FR4 and 266F (130C) for lead free.

The adapters are available in tape and reel for high-speed SMT assembly and can be manufactured for RoHS compliance.

Standard line and trace spacing down to 0.003in (0.076 mm) can be used.

Fine Pitch Bump Adapters are available in panelised form, as an adapter only, or as a turn-key solution with devices mounted.

In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity.

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