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Aries Electronics has announced its CSP/Ballnest hybrid socket suitable for prototyping, test or burn-in of chip scale package, BGA (ball grid array), MicroBGA and LGA (land grid array) devices.

The socket, which features a lid that nests each ball termination into the socket for a reliable connection, can be used on any device with a 0.30mm pitch or larger.

The ZIF-style (zero insertion force) socket uses Aries’s solderless, gold-plated pressure mount spring probes, allowing for easy mounting and removal from the PCB.

The design maintains constant force throughout the entire test and burn-in cycle as well as on the surface mount PCB when no chip is engaged.

The socket bolts on to the target PCB in the same footprint as the socketed device.

This process also enables the socket to be mounted to an adapter board terminated with male thru-pins effectively creating a thru-hole solder tail socket for BGA devices.

The socket cover can also incorporate heat sinks for added test and burn-in flexibility.

A four-point crown ensures ‘scrub’ on solder oxides.

The gold-over-nickel-plated compression spring probes leave small witness marks on the bottom surface of the device solder balls, further increasing reliability.

With a signal path of only 0.077ins (1.96mm), Aries’s socket provides minimal signal loss for higher bandwidth capability.

Special lid designs and materials are available upon request.

The compression spring probes in the Aries CSP/Ballnest hybrid sockets are constructed from heat-treated beryllium-copper with 30 micron inches minimum (0.75 micron mm) gold per Mil-G-45204 over 30 micron min (0.75 micron mm) minimum.

The socket body is Peek or Torlon, while screws and alignment pins are stainless steel and all inserts are tin-plated brass alloy per QQ-B-626.

The socket’s contact forces are 15g per contact on a 0.30mm to 0.35mm pitch, 16g per contact on a 0.40mm to 0.45mm pitch, 25g per contact on a 0.50mm to 0.75mm pitch and 25g per contact on a 0.80mm pitch or larger.

Operating temperature is -55C to 150C (-67F to 302F) and estimated contact life is 500,000 cycles.

As with all Aries sockets, the new test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

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