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Intertronics has introduced the Dymax 9100 series of light- and moisture-cure encapsulants, which is designed to protect small areas of printed circuit boards where sensitive chips or other devices can be encapsulated by a glob top process.

The series — which comprises the Dymax 9101, 9102 and 9103 — provides a rapid secondary moisture cure for shadowed areas. The additional curing process is said to provide a more secure cure where the adhesive may flow under the encapsulated device. This could be a chip-on-board application where there is a need to lend mechanical support to fragile wire connections, as well as chip-on-flex, chip-on-glass and traditional wire bonding.

Localised protection may be selectively provided to a particular area for vibration damping, structural integrity, mechanical protection or environmental protection reasons.

Key benefits

  • The Dymax 9100 series consists of resilient, chip-encapsulant materials designed with a UV/visible light cure and a very quick secondary ambient moisture-cure system.
  • The encapsulants are said to be particularly suitable for encapsulation applications where shadowed areas are present.
  • The materials cure tack free after UV cure, so boards can be handled sooner with less potential for damage.
  • The rapid two-day moisture cure — compared with seven days typical with other systems — shortens the time for further handling, as well as final testing and assembly. 
  • The materials have varying viscosities of 7,000cP, 17,000cP and 25,000cP to match the material creep and slump required for particular applications. This choice allows for performance and dispensing to be optimised with jet-dispensable capability for more accurate placement and more efficient material usage.
  • The cured materials are flexible, reducing stress to onboard components.
  • The Dymax 9100 series does not require refrigeration for transportation or storage of the uncured material, so no additional associated costs are incurred.

Intertronics

INTERTRONICS supplies a comprehensive range of bonding and protective materials – together with the associated consumables and equipment – to customers in high technology, high performance assembly industries – including electronics, medical device, plastics, optical, automotive, energy, defence and aerospace.

INTERTRONICS supplies a comprehensive range of bonding and protective materials – together with the associated consumables and equipment – to customers in high technology, high performance assembly industries – including electronics, medical device, plastics, optical, automotive, energy, defence and aerospace. The company supplies over 3,000 regular customers, including multinational manufacturing giants, production facilities, specialist design and development businesses, universities, training organisations and government establishments.

adhere is INTERTRONICS’ brand which encompasses its bonding, coating, sealing, encapsulating, potting, masking and gasketing materials, together with the most appropriate equipment and accessories for dispensing and curing them.

Because adhere brings together this proven range of integrated products from selected and trusted partners, INTERTRONICS’ customers have the confidence that everything will work together efficiently and cost-effectively, underpinned by the company’s experience and expert advice.

This advice is an essential element of the programme, and it ensures that customers benefit from the optimal material and process choice for the manufacture, assembly or repair of their products … safeguarding and enhancing performance and integrity and in turn, profitability and reputation.

Also key to customer success and satisfaction are the provision of process implementation and training, ongoing expert technical support and the assurance of highly competent supply chain management.

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