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Schroff has introduced a range of VPX clamshells that safeguard printed circuit boards in the extreme environmental conditions associated with defence applications.

As well as providing an efficient conduction cooling method for transferring heat generated by high-performance components, the clamshells are designed to protect boards from the effects of shock and vibration.

Based on the VITA 46/48 specifications, these robust clamshells are primarily intended for use in ruggedised VPX systems.

They consist of a two-part covering for 3 or 6U PCBs and can also accommodate ccPMC or XMC mezzanine cards.

The clamshells are supplied complete with Wedge-Lok or Card-Lok PCB retainers and extractor handles, which provide ample force to easily disengage the high-contact-density board connectors that are typically used in VPX systems.

Manufactured from aluminium alloy for high thermal conductivity and lightweight strength, the clamshells can be specified with various finishes, including black anodised, chemical film, electroless nickel plating and custom silk screening.

They are available with standard hollow covers and can also be custom machined to match the contours of the board topography, allowing heat to be removed from particular hot spots with the aid of thermal gap-filling materials.

Schroff also offers variants designed for use in VME/VME64x (IEEE 1101.2) and CompactPCI (VITA 30.1) systems.

For over four decades Schroff has been a world leader in the development and manufacture of electronics packaging components and systems.

The company offers a comprehensive range of enclosure solutions, including cabinets, subracks, cases, backplanes and power supplies, as well as complete systems for standard bus architectures such as VME, cPCI, AdvancedTCA and MicroTCA.

These products are based on the know-how of specialists in the integration of mechanical, electronic and thermal management systems, together with many years’ experience of the most diverse applications in all kinds of environments. Schroff technical personnel are also heavily involved in the development of international standards for electronics packaging systems, with representatives on numerous working groups of institutions such as the IEC, CENELEC, IEEE, BSI, VDE and DIN.

To complement its wide range of products, the company has established a co-ordinated service strategy designed to ensure that customers enjoy comprehensive support throughout the life of the product.Grouped together under the banner ‘ServicePLUS’, Schroff’s product support services are now arranged in eight modules comprising configuration, assembly, modification, solution, express, support, academy and lifecycle.

The Schroff website, provides full technical information on all of the company’s products, including detailed descriptions, technical data, user manuals, test reports and downloadable CAD drawings

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