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Corelis has released two DDR3 ScanDIMM modules that provide interconnect testability solutions for DDR3 sockets.

Inserting the ScanDIMM into the DIMM socket of a UUT results in placing a fully bi-directional boundary-scan cell behind each pin of the DIMM connector, increasing the test coverage to include not only data and address signal pins, but also clock, control and all power and ground pins.

Utilising this improved cell architecture, test pattern generation tools, such as Corelis’s Scanexpress TPG, can apply the most optimal diagnostic algorithms to clearly isolate any failure under investigation.

DDR3 is a high-performance memory solution for central-processing-unit (CPU) systems pushing the envelope in key areas such as power consumption, signalling speeds and bandwidth, while bringing new levels of performance to desktop, notebook and server computing, according to the company.

DDR3 supports data rates of 1,333MT/s to 1,600MT/s, with clock frequencies of 667MHz to 800MHz respectively.

In addition, DDR3’s standard 1.5V supply voltage cuts power consumption by up to 30 per cent over DDR2.

DDR3 ScanDIMM modules are fully compatible with Corelis’s Scanexpress family of software products and come complete with all necessary cabling.

According to the company, 240-pin and 204-pin form factors are offered with both standard and mirrored pin-outs available in the 204-pin package.

They conform to JEDEC mechanical specifications, MO-269F and MO-268C respectively, and are available from stock with a list price of USD1,500 (GBP906).

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