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TTI is launching Harwin’s range of surface-mount wire-management EZ-Cable Clips.

The clips are designed to be automatically placed and soldered directly to the PCB, and replace plastic devices that require installation by hand.

Harwin’s metal clips are physically smaller than equivalent plastic wire-management clips.

They are placed directly onto solder pads, negating the need to drill retaining holes in the PCB.

The clips are ultra-low profile and do no protrude through the PCB.

TTI’s promotion covers other EZ Boardware products, including EZ-Shield Clips that can be surface mounted – allowing an RFI shielding to be simply pushed into place during final assembly.

EZ-RFI Fingers facilitate electrical contact between PCB and metal cases, EZ-Jumper Links enable designers to eliminate through-hole vias and multi-layer construction, and EZ-Test Points provide technicians with easy-to-see test points and minimise the risk of PCB damage by incorrect test methods.

EZ-Cable clips can be soldered directly to PCB

TTI is launching Harwin’s range of surface-mount wire-management EZ-Cable Clips.

The clips are designed to be automatically placed and soldered directly to the PCB, and replace plastic devices that require installation by hand.

Harwin’s metal clips are physically smaller than equivalent plastic wire-management clips.

They are placed directly onto solder pads, negating the need to drill retaining holes in the PCB.

The clips are ultra-low profile and do no protrude through the PCB.

TTI’s promotion covers other EZ Boardware products, including EZ-Shield Clips that can be surface mounted – allowing an RFI shielding to be simply pushed into place during final assembly.

EZ-RFI Fingers facilitate electrical contact between PCB and metal cases, EZ-Jumper Links enable designers to eliminate through-hole vias and multi-layer construction, and EZ-Test Points provide technicians with easy-to-see test points and minimise the risk of PCB damage by incorrect test methods.

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