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Intertronics has introduced Dymax OP-67-LS, a fast-cure, low-shrink opto-mechanical adhesive for optic assembly that eliminates part movement.

Dymax OP-67-LS adhesive cures in seconds for bonding of optical components, while its low-shrink nature is said to virtually eliminate movement during curing and subsequent thermal cycling.

OP-67-LS offers the ability to ‘cure on demand’ with exposure to longwave UV and visible light, allowing maximum flexibility in positioning parts prior to cure.

The adhesive features 0.2 per cent linear shrinkage upon cure.

OP-67-LS offers good moisture resistance, low outgassing, and adhesion to a variety of substrates including metal, glass, ceramic and polycarbonate, allowing its use in critical and demanding applications, including fibre-optic ‘V’ groove bonding, positioning laser diodes, fibre pig tailing, transceiver potting, VCSEL positioning and mounting active devices, or passive couplers, prisms and other optical device assemblies.

Fast-cure adhesive bonds optical components

Intertronics has introduced Dymax OP-67-LS, a fast-cure, low-shrink opto-mechanical adhesive for optic assembly that eliminates part movement.

Dymax OP-67-LS adhesive cures in seconds for bonding of optical components, while its low-shrink nature is said to virtually eliminate movement during curing and subsequent thermal cycling.

OP-67-LS offers the ability to ‘cure on demand’ with exposure to longwave UV and visible light, allowing maximum flexibility in positioning parts prior to cure.

The adhesive features 0.2 per cent linear shrinkage upon cure.

OP-67-LS offers good moisture resistance, low outgassing, and adhesion to a variety of substrates including metal, glass, ceramic and polycarbonate, allowing its use in critical and demanding applications, including fibre-optic ‘V’ groove bonding, positioning laser diodes, fibre pig tailing, transceiver potting, VCSEL positioning and mounting active devices, or passive couplers, prisms and other optical device assemblies.

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