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Samsung Electronics will switch its entire stencil requirement at a site in Hungary to Alpha Tetrabond, a frameless stencil technology launched by Alpha, a Cookson Electronics company.

Samsung reported being impressed with the rigidity of the stencil foil, the simplicity of the design and the ease of use of Alpha Tetrabond.

The culmination of frameless stencil development, Alpha Tetrabond is a simple system designed to enhance the rigidity of the stencil foil, making safe mounting and demounting an easier proposition.

Encompassed in a thin, one-piece aluminium extrusion, Alpha Tetrabond stencil foils are designed for use with Tetra foil tensioning frames and are backward compatible with the majority of frames currently in the market, including Vectorguard.

They are available with all Alpha Stencil technologies (Alpha Cut, Alpha Form and Alpha Nickel-Cut) to suit the majority of printer size requirements.

Alpha — Cookson Electronics

Alpha, a business unit of Cookson Electronics, is the global leader in the development, manufacturing and sales of innovative materials used in electronic assembly processes. With a unique worldwide presence of over 30 locations throughout the Americas, Europe and the Asia/Pacific region,

Alpha supplies a full line of ALPHA Solder Paste, Stencils, Squeegee Blades, Stencil and PCB Cleaners, Bar Solder, Cored Wire Solder, Wave Soldering Fluxes, SMD Adhesives and a line of ALPHA Argomax sinter paste.

Alpha’s Cookson Electronics Semiconductor Packaging unit is the leader in polymeric and soldering materials for semiconductor packaging.

Alpha also offers product technologies for the Photovoltaic market to help lower production costs and increase throughput and yield. Since its founding in 1872, Cookson Electronics has been committed to developing and manufacturing the highest quality electronics and industrial materials. That tradition continues today through its innovative line of environmentally friendly Greenline products. For more information visit our website.

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