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MHandW International has added TP-S3LS ultra-low-silicone gap fillers to its line of thermal interface materials.

TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0W/mK of thermal conductivity between hot components and their heatsinks.

The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications, including medical electronics, laser optics and telecommunications, where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications.

The TP-S3 range of materials was developed by Chang Sung Corporation and is manufactured by Dongyun Electronics in South Korea.

Pads of TP-S3LS material are soft and compliant for the compression and filling of air gaps between irregular mating surfaces.

The material’s Shore 00 hardness is 55.

TP-S3LS pads can be used in temperatures up to 200C, which exceeds the use range of silicone-free gap fillers.

The material has a UL 94 flame-class rating of V-0.

Its dielectric breakdown voltage is more than 5.0kV.

New TP-S3LS gap filler material is available in 210 x 297mm (8.3 x 11.7in) sheets or die-cut parts.

Standard sheet thicknesses range from 0.5mm to 5.0mm (0.020in to 0.196in).

An optional fibreglass liner is available on 0.5mm-thick pads where added handling strength is needed.

Pricing for standard flat TP-S3LS sheets starts at USD0.10 (GBP0.06) per square inch.

Lower-priced TP-S3 gap fillers are also available with thermal conductivities of 2.0W/mK and 1.0W/mK.

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