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Wireless connectivity specialist Gradconn is launching a Micro SIM connector for 3FF (3rd form factor) SIM cards, which are utilised in the portable electronics market.

The CH03-FA connector accepts the Micro SIM card, which is also known as Mini UICC or 3FF.

Micro SIM cards have the same thickness and contact arrangement as a standard SIM card; however, the reduced card size of 12mm x 15mm shows savings in both PCB and card footprints.

With six or eight contacts and a profile height of just 2.6mm CH03-FA is available in tape and reel packaging, withstands IR reflow temperatures and is fully RoHS compliant.

Customers can contact their local Gradconn sales offices for pricing and free samples for approval.

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