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Techmatrix has announced the launch of the HBR50 reflow-soldering, heat-bonding and heat-staking system.

The company said the unit is ideal for various thermo-compression applications like hot-bar reflow soldering flex circuits, ribbon cable and wires, heat-seal bonding connectors, or attaching ACF connectors to printed circuit boards.

It is also capable of quickly heat-staking metal contacts to plastic.

The HBR50 integrates a high-performance pulsed temperature controller with PID feedback and can be configured with any combination of X, Y, Z, or theta stages to meet the customer’s needs.

The machine is controlled with the Weldworks software suite making it easy for users to manage thousands of temperature profiles and parts across the enterprise.

Process data is collected and analysed after each run and stored in a central database.

Techmatrix can design custom fixtures, jigs, and thermodes or the customer can purchase the base system and configure it internally.

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