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Hirose Electric has updated its high density board-to-board connector family.

The IT3 Series Mezzanine connector is a three-piece modular system that provides easier assembly, reliable X-ray inspection, better reflow performance and higher production yield between two parallel PC boards without sacrificing connector performance.

Tats Arai, senior vice-president at Hirose Electric, said: ‘The new IT3 connector design simplifies the automated reflow assembly process, resulting in reduced solder-joint failure and significantly higher production yields in any configuration or application.’ Hirose’s IT3 Mezzanine connector system features a three-piece modular design consisting of two low-profile receptacles mounted to each parallel PC board with BGA solder balls mounted in a staggered array of 1.5 x 1.75mm pitch.

A floating interposer module connects the two mounted receptacles and reduces the possibility of mechanical damage to the BGA joints.

The IT3 Series connector system is currently available in 100-, 200- and 300-position modules, with interposers for board stack heights from 15 to 40mm.

The IT3 Series connectors are rated at 50 ohm single-ended impedance and 100 ohm differential impedance.

BGA solder balls are available in standard eutectic tin-lead (Sn63-Pb37) or lead-free (Sn-Ag3.0-Cu0.5).

IT3 Series connectors are qualified to EIA-364-1000 for environmental performance and IPC-9701 for long-term solder joint reliability.

Hirose recently announced an agreement with Tyco Electronics to provide a second source for the IT3 Series connectors under the Tyco brand name Strada MZConn3 Series.

The company expects dual sourced product to be available to customers from Tyco in mid-2009.

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