Product Details Supplier Info More products

Endicott Interconnect Technologies has announced improved capabilities for its HyperBGA PTFE-based ‘coreless’ semiconductor package.

It now has more power and density with the addition of signal layers and enables semiconductor devices to run at extremely high speeds.

The combination of the low loss, low dielectric constant material and strip line cross sections enable digital signal speeds of more than 12Gb/s.

According to the company, HyperBGA offers the longest flip chip BGA life available.

The material compliance of the PTFE material eliminates BGA wear-out, die cracking, delamination and flip chip bump fatigue.

The company adds that this translates into extended life for large die and system-in-packages (SiP) for mission-critical applications.

HyperBGA is assembled using standard SMT processes and materials, making columns or land grid array sockets unnecessary.

It is capable of flip chip, SMT or CSP component attach on both sides.

Functional module testing is available and HyperBGA is lead-free assembly compatible.

The HyperBGA is applicable for networking, high end server, telecommunications, aerospace, military and medical applications where speed, reliability and increased signal I/O, along with reduced size, weight and power, are important.

This low stress flip chip laminate package is also suited for multi-layer, RF, chip-on-flex or any application requiring a SiP approach.

Endicott Interconnect Technologies

View full profile