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Indium has released the Indium8.9HF Solder Paste, a halogen-free and Pb-free solder paste with good print-transfer efficiency and response-to-pause printing.

The rheology of Indium8.9HF is suitable for advanced 0.4mm pitch and 0201 technologies.

Indium8.9HF possesses an activator package and outstanding oxidation barrier, which allows it to coalesce and wet as good as its halogen-containing counterparts.

The oxidation barrier prevents graping on small passives.

The combination of outstanding oxidation barrier and high slump-resistance allows Indium8.9HF to effectively eliminate head-in-pillow defects.

Indium8.9HF can be manufactured with SnPb powder to allow it to be used on products exempt from RoHS.

Using Indium8.9HF in a SnPb process offers high thermal stability and low voiding in mixed-alloy applications.

It also eliminates the need to change solder-paste chemistry when transitioning to an RoHS-compliant environment.

Indium8.9HF ensures compliance with Reach, RoHS and future halogen-restricting legislation.

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